* Suitable for highly efficient laser via formation
* Compatible with conventional HDI process
* High copper foil peel strength & thermal resistance
* High Tg/halogen-free for choice
* Portable electronic equipment such as mobile phone, PDA & digital camcorders, and etc.
* Copper Foil: 12~18um
* Resin Content: 30~100um
* Product Size: 500mm width or upon requests.
For more details, please don't hesitate to touch us by phone, fax or email in time.